Tungsten needle can be used as a wafer probe. Wherein, tungsten probe is used as a tool for IC (integrated circuit) wafer probing on the circuit board of the probe card, or on the prober, mainly to test the electrical performance of each die on the wafer to see whether they are manufactured in accordance with the designed specifications.
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Wafer probing is an important process during production of integrated circuit. It is a way to save the packaging cost – the cost of packaging waste chips. Nowadays, wafer probing has become a key factor in process control, yield management, product quality, and reduction of the total test cost. Therefore, the quality of the wafer probe will affect the test cost, product quality and other factors. Therefore, it is very important to choose a high quality probe. It is believed that tungsten needles have been widely used in wafer probing as probes.
