
Controlling heat dissipation in sealed equipment housing electronic components is a major challenge in the electronics industry. Molybdenum copper and tungsten copper composite materials are engineered through wrought powder technology to provide higher thermal conductivity and highly controllable thermal expansion, so as to meet the requirements of the applications. Key applications for molybdenum copper materials include heat sink materials, bases, substrates, heat sinks, machined components and material blanks. Among them, molybdenum copper heat sinks are widely used in microwave carriers,…