
Tungsten needle can be used as a wafer probe. Wherein, tungsten probe is used as a tool for IC (integrated circuit) wafer probing on the circuit board of the probe card, or on the prober, mainly to test the electrical performance of each die on the wafer to see whether they are manufactured in accordance with the designed specifications. More details, please visit: http://tungsten.com.cn/tungsten-needles.html Wafer probing is an important process during production of integrated circuit. It is a way to…